ICPADM 2027 invites researchers and practitioners to submit original contributions in all areas of dielectric materials and electrical insulation.
The organizing committee of ICPADM 2027 is calling for full paper submissions. All submissions must be written in English using the IEEE paper template. Registered and presented papers will be published in the ICPADM 2027 Proceedings and submitted for inclusion in the IEEE Xplore Digital Library.
High-quality papers may be invited to submit an extended version for potential publication in selected IEEE journals.
Submissions are welcomed in, but not limited to, the following areas: